Single poly non-volatile memory device, method of manufacturing the same and single poly non-volatile memory device array

ABSTRACT

A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.

CROSS-REFERENCE TO RELATED APPLICATION

This is a division of U.S. application Ser. No. 16/256,137 filed on Jan.24, 2019, which is a division of U.S. application Ser. No. 15/402,259filed on Jan. 10, 2017, which claims the benefit under 35 USC 119 ofKorean Patent Application No. 10-2016-0005621, filed on Jan. 15, 2016,in the Korean Intellectual Property Office, the entire disclosure ofwhich is incorporated herein by reference for all purposes.

BACKGROUND 1. Field

This disclosure relates to a single poly non-volatile memory device, andmore particularly, to a single poly non-volatile memory device and amethod of manufacturing and arranging the same that improve operationefficiency and reduce an area by disposing a sensing transistor and aselection transistor at one well and a control gate at another well.

2. Description of Related Art

A non-volatile memory device may be referred to as a Non Volatile Memory(NVM) and can stably store data for a long period without power.Representative nonvolatile memory devices include flash memory deviceand an Electrical Erasable Programmable Read-Only Memory (EEPROM)devices. An EEPROM can electrically erase and restore data storedtherein through conversion of an erasable programmable read-only memory(EPROM). Therefore, the non-volatile memory device is conveniently usedin an application field requiring to restore a program and may store orerase data by electrically changing electric charges of an elementconstituting a chip. Because the non-volatile memory device canelectrically read or store data, the non-volatile memory device may beprogrammed again in a state embedded in a system and is thus used in anapplication field requiring information change of a user.

In general, an EEPROM uses a double poly structure that stacks two polysor a single poly structure using one poly, and the present inventionrelates to a single poly non-volatile element using one poly. The singlepoly non-volatile element may be formed without a separate high voltageprocess or high voltage element using a method of applying +V_(PP) and−V_(PP) upon performing a program or erase operation. That is, bychanging a medium voltage device to a single poly non-volatile memorydevice without a high voltage process or a high voltage element and byconstituting a circuit with the medium voltage device, the single polynon-volatile element may be compatible with a logic process. Thereby,there is a merit that a production step reduces and thus a cost reducesand a production time is shortened.

In a conventional single poly non-volatile memory device, a tunnelingarea and a sensing transistor are implemented in a separated structureto increase an area of a memory cell. Further, in the conventional art,the sensing transistor is disposed at a periphery of a source electrode,and by a depletion area according to PN junction, a substantialtunneling area reduces. That is, in the conventional art, uponperforming an erase operation, by reducing the number of electronsinjected or discharged through the sensing transistor, there is aproblem that efficiency of the erase operation reduces.

SUMMARY OF THE INVENTION

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

In one general aspect, a single poly non-volatile memory deviceincludes: a first type lower well; first and second wells separatelyformed in an upper portion of the first type lower well; a sourceelectrode, a selection transistor, a sensing transistor, and a drainelectrode sequentially disposed in an upper portion of the first well;and a control gate formed in an upper portion of the second well withseparated on an opposite side of the source electrode from the firstwell and connected to the gate of the sensing transistor.

The gate of the sensing transistor may further include a tunneling areathat provides a moving passage of electrons toward the lower endthereof.

The single poly non-volatile memory device may further include: a firstactive area including the selection transistor and the sensingtransistor; and a second active area including the control gate withseparated from the first active area.

The control gate may be connected to the gate of the sensing transistor,and the control gate and the gate of the sensing transistor may form afloating gate.

The single poly non-volatile memory device may further include first tothird doping layers disposed in an upper portion of the first well andformed adjacent to the selection transistor and the sensing transistor.

The single poly non-volatile memory device may further include a firstdiffusion area disposed at a lower portion of the source electrode andadjacent to the first doping layer.

The second doping layer may share a drain area of the selectiontransistor and a source area of the sensing transistor.

The third doping layer may correspond to a drain area of the sensingtransistor, be disposed on an opposite side of the selection transistor,and include a drain electrode in an upper portion thereof.

The single poly non-volatile memory device may further include: acontrol gate electrode formed at one side of the control gate in anupper portion of the second well; and a second diffusion areaimplemented into a single area in a lower portion of the control gateelectrode.

The second active area may include an entire area of the control gateand the control gate electrode to improve operation efficiency of thecontrol gate.

The second active area may further include an implant area formed in anupper portion of the second well to be disposed at the lower end of thecontrol gate.

Program and erase operation voltages may be applied through the sourceelectrode and the control gate.

A negative voltage may be applied to the source electrode and a positivevoltage may be applied to the control gate, upon a program operating,and a positive voltage may be applied to the source electrode and anegative voltage may be applied to the control gate, upon an eraseoperates.

In accordance with another general aspect, a method of manufacturing asingle poly non-volatile memory device includes: forming a first typelower well by doping first type impurities in a semiconductor substrate;forming first and second wells separated in an upper portion of thefirst type lower well and forming a first type well to enclose each ofthe first and second wells by doping second type impurities; and forminga selection transistor and a sensing transistor in an upper portion ofthe first well and simultaneously forming a control gate in an upperportion of the second well separated on an opposite side of the sourceelectrode from the first well.

The selection transistor and the sensing transistor may be formed in afirst active area and may include a gate of the sensing transistor and agate of the selection transistor.

The control gate and the gate of the sensing transistor may beconnected.

The method may further include forming a second doping layer that sharesa drain area of the selection transistor and a source area of thesensing transistor.

In accordance with another general aspect, a single poly non-volatilememory device array, includes one cell may be formed with a selectiontransistor, a sensing transistor, and a control gate is formed in anarray form to share a control gate and a source electrode of an adjacentselection transistor, and wherein program and erase operation voltagesare applied to the control gate and the source electrode of theselection transistor.

A single poly non-volatile memory device to be a target of program orerase may be selected from the single poly non-volatile memory devicearray, and a programming voltage may be applied to the selected at leastone single poly non-volatile memory device, and wherein a portion of theprogramming voltage may be applied to unselected single polynon-volatile memory devices in order to minimize a voltage differenceapplied to the unselected single poly non-volatile memory devices amongthe plurality of single poly non-volatile memory devices upon performingthe program or erase operation. A portion of the programming voltageapplied to the unselected single poly non-volatile memory devices maycorrespond to ⅓ of the programming voltage.

In a general aspect, a single poly non-volatile memory device mayinclude a first type lower well; first and second wells enclosed in thefirst type lower well and separated from each other; a source electrode,a selection transistor, a sensing transistor, and a drain electrodesequentially disposed in the first well. The single poly non-volatilememory device also includes a control gate formed in the second wellwith separated on an opposite side of the source electrode from thefirst well and connected to a gate of the sensing transistor. Programand erase operation voltages are applied to the control gate and thesource electrode of the selection transistor.

A single poly non-volatile memory device may a target of program orerase and may be selected from the single poly non-volatile memorydevice array, and a programming voltage may be applied to the selectedsingle poly non-volatile memory device. A portion of the programmingvoltage may be applied to unselected single poly non-volatile memorydevices minimizing a voltage difference applied to the unselected singlepoly non-volatile memory devices among the single poly non-volatilememory devices upon performing the program or erase operation.

A portion of the programming voltage applied to the unselected singlepoly non-volatile memory devices corresponds to ⅓ of the programmingvoltage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are perspective views illustrating a single polynon-volatile memory device according to an example.

FIGS. 2A and 2B are views illustrating a plane and a cross-section ofthe single poly non-volatile memory device of FIG. 1.

FIGS. 3A and 3B are views illustrating a plane and a cross-section ofthe single poly non-volatile memory device of FIG. 1.

FIG. 4 is a graph illustrating a program voltage and erase voltagedistribution of the single poly non-volatile memory device of FIG. 1.

FIG. 5 is a graph illustrating a program voltage and an erase voltagewhen an implant area is formed in the single poly non-volatile memorydevice of FIG. 1.

FIGS. 6A and 6B are conceptual diagrams illustrating a method ofarranging a single poly non-volatile memory device.

FIGS. 7A and 7B are conceptual diagrams illustrating a method ofarranging the single poly non-volatile memory device of FIG. 1 accordingto an example.

FIG. 8 is a circuit diagram illustrating the single poly non-volatilememory device of FIG. 1.

FIG. 9 is a circuit diagram illustrating single poly non-volatile memorydevices arranged with a method of arranging a single poly non-volatilememory device of FIGS. 7A and 7B.

FIGS. 10A and 10B are graphs illustrating a performance of single polynon-volatile memory devices arranged with a method of arranging a singlepoly non-volatile memory device of FIGS. 7A and 7B.

FIG. 11 is a diagram illustrating an example of a method ofmanufacturing a single poly non-volatile memory device illustrated inFIGS. 1A and 1B.

Throughout the drawings and the detailed description, the same referencenumerals refer to the same elements. The drawings may not be to scale,and the relative size, proportions, and depiction of elements in thedrawings may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

The following detailed description is provided to assist the reader ingaining a comprehensive understanding of the methods, apparatuses,and/or systems described herein. However, various changes,modifications, and equivalents of the methods, apparatuses, and/orsystems described herein will be apparent after an understanding of thedisclosure of this application. For example, the sequences of operationsdescribed herein are merely examples, and are not limited to those setforth herein, but may be changed as will be apparent after anunderstanding of the disclosure of this application, with the exceptionof operations necessarily occurring in a certain order. Also,descriptions of features that are known in the art may be omitted forincreased clarity and conciseness.

The features described herein may be embodied in different forms, andare not to be construed as being limited to the examples describedherein. Rather, the examples described herein have been provided merelyto illustrate some of the many possible ways of implementing themethods, apparatuses, and/or systems described herein that will beapparent after an understanding of the disclosure of this application.

An exemplary embodiment is merely an exemplary embodiment for astructural or functional description and thus it should not be analyzedthat the scope of the present invention is limited by an exemplaryembodiment described in a detailed description.

A meaning of terms described in an exemplary embodiment should beunderstood as follows. A term such as “first” and “second” is used fordistinguishing a constituent element from another constituent element.

When it is described that a constituent element is “connected” or“electrically connected” to another constituent element, the element maybe “directly connected” or “directly electrically connected” to theother constituent elements or may be “connected” or “electricallyconnected” to the other constituent elements through a third element.However, when it is described that a constituent element is “directlyconnected” or “directly electrically connected” to another constituentelement, no element may exist between the element and the other element.Expressions, i.e., “between” and “immediately between” or “adjacent to”and “directly adjacent to” describing a relationship between constituentelements should be similarly analyzed.

Singular forms used here include a plurality of forms unless phrasesexplicitly represent an opposite meaning, and a term of “comprising” or“having” used in a specification embodies a characteristic, number,step, operation, element, component, or combination thereof and does notexclude presence or addition of another characteristic, number, step,operation, element, component, or combination thereof.

FIGS. 1A and 1B are perspective views illustrating a single polynon-volatile memory device according to an example.

Generally, memory devices may be manufactured using well knowndeposition methods. The most common deposition processes include, butnot limited to, filament evaporation, electron-beam evaporation, flashevaporation, induction evaporation, and sputtering. The synthesis n-typesemiconductors may involve the use of vapor-phase epitaxy. Further,structures may be formed in various layers of a semiconductor usingmasks, etching and ablating processes. Also, doping may be used tointroduce impurities into a semiconductor for the purpose of modulatingits electrical properties.

Referring to FIGS. 1A and 1B, a single poly non-volatile memory device100 that may include a second type substrate 10, a first type lower well110, an insulating layer 120, first and second wells 121 and 122, firstto third doping layers 131, 132, and 133, first and second diffusionareas 141 and 142, a control gate 170, a floating gate 180, and acontrol gate electrode 194.

In the single poly non-volatile memory device 100, a production step anda mask added by improving from a conventional double poly structure intoa single poly structure using one poly can be simplified. That is, thesingle poly non-volatile memory device 100 can have an advantage of costreduction and production time reduction. It is characterized that thesingle poly non-volatile memory device 100 according to the presentexample is changed from a medium voltage device of a basic logic processfor producing a semiconductor chip to be compatible with a logicprocess.

The second type substrate 10 may correspond to a base of the single polynon-volatile memory device 100. In an example, the second type substrate10 may be implemented into a P type substrate. The second type substrate10 is formed in a lowermost portion of the single poly non-volatilememory device 100.

In FIG. 1A, the first type lower well 110 may be formed on the secondtype substrate 10. By doping and diffusing first type impurities in thesecond type substrate 10, the first type lower well 110 may be formedfrom an upper portion of the lower well 110 to a surface of an activearea.

By doping first type or second type impurities in the first type lowerwell 110, a first type well 112 or the first and second wells 121 and122 may be formed.

The first and second wells 121 and 122 may be separately formed in anupper portion of the first type lower well 110. The first and secondwells 121 and 122 each may correspond to a first or second active area.The first or second active area may be separated by the insulating layer120. In an example, the insulating layer 120 may be formed with ShallowTrench Isolation (STI) or Local Oxidation of Silicon (LOCOS). Further,the first and second wells 121 and 122 may be formed by separatelydoping second type impurities. In an example, the first well 121 and thesecond well 122 may be formed in a predetermined depth in a separatedarea of an upper portion of the first type lower well 110 and may beimplemented into a P type well.

The first type well 112 may be formed to separate the first and secondwells 121 and 122. The first type well 112 may be disposed to encloseeach of the first and second wells 121 and 122 in an upper portion ofthe first type lower well 110. That is, because the first and secondwells 121 and 122 each are enclosed through the first type lower well110 and the first type well 112, the first and second wells 121 and 122may be separated from each other. In an example, in order to separatethe first and second wells 121 and 122, the first type well 112 may beformed by doping first type impurities to enclose each of the first andsecond wells 121 and 122. The first type well 112 may be formed in apredetermined depth in an upper portion of the first type lower well 110and may be implemented into an N type well. In an example, the firsttype lower well 110 may be formed in an upper portion of the second typesubstrate 10 and may be implemented into an N-lower well layer.

In FIG. 1B, the first type lower well 110 may be formed in a portion ofthe second type substrate 10. The first type lower well 110 may beformed by doping first type impurities in a portion of the second typesubstrate 10, and the first type lower well 110 may be verticallyenclosed by the second type substrate 10. That is, a portion 10 a of thesecond type substrate 10 may be disposed in a lower portion of the firsttype lower well 110, and another portion 10 b of the second typesubstrate 10 may be disposed at an upper portion of the first type lowerwell 110. The first type well 112 or the first and second wells 121 and122 may be formed by doping first type or second type impurities in aportion 10 b of the second type substrate 10.

By locating the first to third doping layers 131, 132, and 133 withinthe first well 121, the first to third doping layers 131, 132, and 133may form a source and a drain of the selection transistor and thesensing transistor. More specifically, the first doping layer 131 isformed in a portion adjacent to a gate 161 of the selection transistor,the second doping layer 132 is formed between the gate 161 of theselection transistor and a gate 163 of the sensing transistor, and thethird doping layer 133 is formed in a portion adjacent to the gate 163of the sensing transistor. Here, the second doping layer 132 becomes asource area of the sensing transistor as well as a drain area of theselection transistor.

The first to third doping layers 131, 132, and 133 may be formed in apredetermined depth in an upper portion of the first well 121. In anexample, the first to third doping layers 131, 132, and 133 may beimplemented into an N+ doping layer by injecting a high concentration ofions. In order to form a predetermined depth, in the first to thirddoping layers 131, 132, and 133, a dose amount and energy of ioninjection may be adjusted.

A fourth doping layer 134 may be formed in an upper portion of the firsttype well 112. More specifically, the fourth doping layers 134 a and 134b each may be disposed in an upper portion of the first type well 112 tobe formed at both sides of the single poly non-volatile memory device100. In an example, the fourth doping layers 134 a and 134 b may beimplemented into an N+ doping layer by injecting a high concentration ofions. In order to form a predetermined depth, in the fourth dopinglayers 134 a and 134 b, a dose amount and energy of ion injection may beadjusted.

The first diffusion area 141 may be formed at one side of an upperportion of the first well 121. More specifically, the first diffusionarea 141 may be disposed at a lower portion of a source electrode 191and may contact with the first doping layer 131. The first diffusionarea 141 may be formed by doping second type impurities. In an example,the first diffusion area 141 may be implemented into a P+ doping layerby injecting a high concentration of ions.

The second diffusion area 142 may be formed at one side of an upperportion of the second well 122. More specifically, the second diffusionarea 142 may be implemented into a single area in a lower portion of thecontrol gate electrode 194. The second diffusion area 142 may be formedin a second active area together with the control gate 170. In anexample, the second diffusion area 142 may be formed by doping secondtype impurities and may be implemented into a P+ doping layer byinjecting a high concentration of ions.

In the first active area 141, the selection transistor and the sensingtransistor may be included. More specifically, the selection transistorand the sensing transistor may be disposed at an upper portion of thefirst well 121, and the source electrode 191, the gate 161 of theselection transistor, the gate 163 of the sensing transistor, and adrain electrode 193 may be sequentially disposed.

The selection transistor may be formed at an upper end portion betweenthe first and second doping layers 131 and 132 and may be connected to aselection gate electrode 192. The selection transistor may be turned onor turned off through a voltage applied to the selection gate electrode192. In an example, when the selection transistor is turned on, thesensing transistor may divide data into 0 or 1 according to a program orerase state. In another example, the selection transistor may blockleakage from flowing in an over erase state.

The sensing transistor may be implemented into a tunneling area thatprovides a moving passage of electrons toward the lower end thereof.More specifically, the sensing transistor may be tunneled according to avoltage difference between the control gate electrode 194 and the sourceelectrode 191.

In an example, a second insulating layer 164 may be formed in anappropriate thickness for generating tunneling. First and secondinsulating layers 162 and 164 may be implemented in the same thickness,but a thickness of the first and second insulating layers 162 and 164 isnot limited thereto.

The control gate 170 may be separated on an opposite side of the sourceelectrode 191 from the first well 121 to be formed at an upper portionof the second well 122 and may be connected to the gate 163 of thesensing transistor. More specifically, the control gate 170 may beconnected to the gate 163 of the sensing transistor through the floatinggate 180 formed at the same plane thereof.

The floating gate 180 may include the sensing transistor 163 and thecontrol gate 170. More specifically, a portion of the floating gate 180formed at an upper portion of the first well 121 may correspond to thegate 163 of the sensing transistor, and another portion of the floatinggate 180 formed at an upper portion of the second well 122 maycorrespond to the control gate 170. That is, the sensing transistor 163and the control gate 170 may be connected through the floating gate 180.

The floating gate 180 may charge or discharge electric charges accordingto a voltage applied to the control gate electrode 194 and the sourceelectrode 191. In an example, the floating gate 180 may charge electriccharges to program data and may discharge electric charges to erasedata.

The source electrode 191 may be disposed at an upper portion of thefirst diffusion area 141 and the first doping layer 131. Morespecifically, the source electrode 191 provides a voltage for performingprogram-erase through the first diffusion area 141 and the first dopinglayer 131. More specifically, the source electrode 191 and the controlgate electrode 194 may provide an operation voltage for performingprogram-erase and program or erase data according to the operationvoltage.

The selection gate electrode 192 may be formed at an upper portion ofthe gate 161 of the selection transistor to turn on or turn off theselection transistor 161. Further, the selection transistor may preventleakage of the over erased sensing transistor.

The drain electrode 193 may be formed at an upper portion of the thirddoping layer 133 to be disposed on an opposite side of the selectiontransistor based on the sensing transistor. In an example, the drainelectrode 193 may be implemented into a bit line. The single polynon-volatile memory device 100 may measure an electric charge amountcharged or discharged in the floating gate 180 to read data. That is,while a voltage is applied to the drain electrode 193 and the sourceelectrode 191, when the selection transistor is turned on, the singlepoly non-volatile memory device 100 may read data.

The control gate electrode 194 may be connected to the second diffusionarea 142 formed at an upper portion of the second well 122 and may beformed at one side of the control gate 170. More specifically, thecontrol gate electrode 194 may perform a program-erase operation throughthe second diffusion area 142.

In an example, the single poly non-volatile memory device 100 may apply+6.5V to the control gate electrode 194 and apply −6.5V to the sourceelectrode 191 to program data with an FN tunneling method. Morespecifically, electrons may be tunneled in a lower portion of thesensing transistor by a potential difference between the control gateelectrode 194 and the source electrode 191. When a potential between thecontrol gate electrode 194 and the source electrode 191 corresponds to apositive voltage, electrons may be injected into the floating gate 180.That is, the single poly non-volatile memory device 100 may injectelectrons into the floating gate 180 through the sensing transistor toprogram data.

In another example, the single poly non-volatile memory device 100 mayapply −6.5V to the control gate electrode 194 and apply +6.5V to thesource electrode 191 to erase data with a Fowler Nordheim (FN) tunnelingmethod. More specifically, electrons may be tunneled in a lower portionof the sensing transistor by a potential difference between the sourceelectrode 191 and the control gate electrode 194. When a potentialbetween the control gate electrode 194 and the source electrode 191corresponds to a negative voltage, the floating gate 180 may dischargeelectrons. That is, the single poly non-volatile memory device 100 maydischarge electrons of the floating gate 180 toward the first well 121through the sensing transistor to erase data.

A well electrode 195 may be formed at an upper portion of the fourthdoping layer 134. More specifically, well electrodes 195 a and 195 b maybe formed at upper portions of the fourth doping layers 134 a and 134 b,respectively.

In another example, the first type lower well 110, the first type well112, and the first and second wells 121 and 122 may be formed in randomorder. For example, the first type well 112 is formed, and then thefirst and second wells 121 and 122 may be formed within the first typewell 112. For another example, the first and second wells 121 and 122are separately formed, and then the first type well 112 may be formed toenclose each of the first and second wells 121 and 122. Therefore, evenif a process is performed in random order, the single poly non-volatilememory device 100 may be implemented to have a correspondingconfiguration.

In an example, the single poly non-volatile memory device 100 is notalways limited thereto and may implement a first type into an N type andimplement a second type into a P type. FIG. 1 is merely used fordescribing an example of the present invention and the scope of thepresent invention is not limited thereto.

FIG. 2 is a view illustrating a memory cell of the single polynon-volatile memory device of FIG. 1. More specifically, FIG. 2A is atop plan view illustrating the single poly non-volatile memory device ofFIG. 1 and FIG. 2B is a cross-sectional view illustrating a transistorarea 150 of the single poly non-volatile memory device taken along lineA-A′ of FIG. 2A.

Referring to FIG. 2, the single poly non-volatile memory device 100 mayinclude first and second active areas 210 and 220. In the first activearea 210, the first well 121 may be formed, and at an upper portionthereof, the source electrode 191, the gate 161 of the selectiontransistor, the gate 163 of the sensing transistor, and the drainelectrode 193 may be sequentially disposed within the first active area210.

In an example, the floating gate 180 may be formed via the first andsecond active areas 210 and 220 to connect the control gate 170 and thegate 163 of the sensing transistor. The floating gate 180 may be formedat the same plane as that of the control gate 170 and may charge anddischarge electric charges to and from the floating gate 180 accordingto a voltage applied to the control gate electrode 194 and the sourceelectrode 191.

In an example, the first doping layer 131 and the first diffusion area141 may be connected to the source electrode 191. More specifically, thefirst doping layer 131 and the first diffusion area 141 may share thesource electrode 191 within the first active area 210. Therefore, thesource electrode 191 performs an electrical voltage transfer functionfor performing program-erase through the first doping layer 131 and thefirst diffusion area 141. The source electrode 191 may share a sourcearea of the selection transistor through the first doping layer 131. Byadjacently disposing the first doping layer 131 and the first diffusionarea 141 within one active area, the single poly non-volatile memorydevice 100 can reduce an area thereof while maintaining an electricalfunction.

In an example, the second doping layer 132 may share a drain area of theselection transistor and a source area of the sensing transistor. Thesingle poly non-volatile memory device 100 may omit a terminal betweenthe drain area of the selection transistor and the source area of thesensing transistor through the second doping layer 132. That is, thesingle poly non-volatile memory device 100 may reduce an area thereofthrough the second doping layer 132.

In an example, in the memory cell 150, the source electrode 191, thegate 161 of the selection transistor, and the gate 163 of the sensingtransistor, and the drain electrode 193 may be sequentially disposed.The sensing transistor 820 may be separated far from the sourceelectrode 191 to increase erase efficiency and improve an operationmargin, compared with a case in which the sensing transistor is disposedadjacent to the source electrode 191. Here, an operation margin maycorrespond to the difference between a program voltage and an erasevoltage. In the single poly non-volatile memory device 100, as anoperation margin increases, the number of program and erase operationsof data may increase. Hereinafter, improvement of an operation marginwill be described in detail with reference to FIG. 4.

In an example, the sensing transistor may be implemented into atunneling area. That is, in the sensing transistor, in a program orerase process of data, electrons may be discharged or injected. Thesingle poly non-volatile memory device 100 may form the sensingtransistor and a tunneling area at the same space to reduce an areathereof.

In the second active area 220, the second well 122 is formed, and at anupper portion, the control gate 170 is formed. Further, the second well122 is separately formed from the first active area 210. In an example,the second active area 220 may house an entire area of the control gate170 and the control gate electrode 194 to improve operation efficiencyof the control gate 170. More specifically, in the single polynon-volatile memory device 100, by disposing an entire area of thecontrol gate 170 within the second active area 220, an unnecessaryvoltage can be prevented from being transferred to the control gate 170upon programming or erasing data. Therefore, in the single polynon-volatile memory device 100, a gate area of the outside of the secondactive area 220 of the control gate 170 can be reduced and program orerase efficiency of data can be improved.

FIG. 3 is a diagram illustrating a control gate of the single polynon-volatile memory device of FIG. 1. More specifically, FIG. 3A is atop plan view illustrating the single poly non-volatile memory device ofFIG. 1, and FIG. 3B is a cross-sectional view illustrating the secondwell 122 of the single poly non-volatile memory device taken along lineB-B′ of FIG. 3A.

Referring to FIG. 3, the single poly non-volatile memory device 100 mayfurther include an implant area 310 formed at an upper portion of thesecond well 122 to be disposed at the lower end of the control gate 170.More specifically, the implant area 310 may be disposed parallel to thecontrol gate 170 or wider than the control gate 170 at the lower end ofthe control gate 170. A third insulating layer 172 may be formed betweenthe control gate 170 and the implant area 310. Here, the implant area310 may be disposed at an upper end portion of the second well 122 toimprove an operation margin of the control gate 170 and to increase theprogram and erase number of data.

In an example, the implant area 310 is not always limited thereto, butmay be formed by injecting boron (B+) having the concentration of 3.5E12with energy of 25 KeV and indium (In+) having the concentration of4.3E12 with energy of 170 KeV. Injection of boron (B+) and indium (In+)into the implant area 310 is performed while forming the second well 122and may be thus performed without a separate addition mask for thesingle poly non-volatile memory device. That is, while the second well122 is formed, the implant area 310 is formed and thus a separateprocess is not required.

FIG. 4 is a graph illustrating a program voltage and an erase voltage ofthe single poly non-volatile memory device of FIG. 1. More specifically,FIG. 4 is a graph illustrating improvement of erase efficiency of asingle poly non-volatile memory device in which a source electrode, aselection transistor, a sensing transistor, and a drain electrode aresequentially disposed.

Referring to FIG. 4, in the single poly non-volatile memory device 100,the source electrode 191, the selection transistor 810, the sensingtransistor 820, and the drain electrode 193 may be sequentially disposedon the first well 121. A case A in which the sensing transistor 820 isdisposed far separately from the source electrode 191 can increase eraseefficiency and improve an operation margin further than a case B inwhich the sensing transistor is disposed adjacent to the sourceelectrode 191. That is, the single poly non-volatile memory device 100can reduce an erase voltage by about 1.5V further than a case B ofdisposing the sensing transistor 820 adjacent to the source electrode191. That is, the single poly non-volatile memory device 100 can securean operation margin corresponding to about 1.5V with only a dispositionof the source electrode 191, the selection transistor 810, the sensingtransistor 820, and the drain electrode 193. That is, in a case A inwhich the source electrode 191 is disposed far separately from thesensing transistor, erase efficiency can be improved.

FIG. 5 is a graph illustrating a program voltage and an erase voltagewhen an implant area is formed in the single poly non-volatile memorydevice of FIG. 1.

Referring to FIG. 5, by forming the implant area 310, the single polynon-volatile memory device 100 may increase a program voltage (ProgramVT, Program Voltage Threshold) by about 0.2V and reduce an erase voltage(Erase VT, Erase Voltage Threshold) by about 2V. That is, by increasinga difference between a program voltage and an erase voltage, the singlepoly non-volatile memory device 100 can improve an operation margin.That is, when a difference between a program voltage and an erasevoltage increases, durability of the single poly non-volatile memorydevice 100 can be guaranteed. By improving an operation margin, thesingle poly non-volatile memory device 100 can improve a data retentionability according to the program and erase number of data.

FIG. 6 is a conceptual diagram illustrating a method of arranging asingle poly non-volatile memory device.

Referring to FIG. 6, conventionally, when performing a program or eraseoperation of the first to fourth single poly non-volatile memory devices100 a, 100 b, 100 c, and 100 d, each device may be connected to aprogramming voltage (V_(PP), −V_(PP)) or the ground GND. For a programor erase operation, when a corresponding voltage is applied to thecontrol gate and the source electrode, at least one single polynon-volatile memory device to be a target of program or erase may beselected, and a programming voltage (+V_(PP), −V_(PP)) may be applied tothe selected at least one single poly non-volatile memory device. Aprogramming voltage (+V_(PP), −V_(PP)) or the ground GND may beconnected to each of the unselected (or no target of program-erase)single poly non-volatile memory devices.

For example, the first single poly non-volatile memory device 100 a maybe selected as target of program or erase, and the second to fourthsingle poly non-volatile memory devices 100 b to 100 d may not beselected. In this case, a programming voltage (V_(PP), −V_(PP)) may beapplied to a source electrode and a control gate of the first singlepoly non-volatile memory device 100 a, and a voltage difference betweenboth ends thereof may be 2V_(PP). A programming voltage (+V_(PP),−V_(PP)) or the ground GND may be connected to each of the second tofourth single poly non-volatile memory devices 100 b, 100 c, and 100 d,and voltage differences applied to each of the second to fourth singlepoly non-volatile memory devices 100 b, 100 c, and 100 d may be V_(PP),V_(PP), 0, respectively. Therefore, in a conventional method ofarranging a single poly non-volatile memory device, a difference occursbetween voltages applied to both ends of each of unselected single polynon-volatile memory devices and thus a problem may occur that data ofthe unselected single poly non-volatile memory devices are changed.

Therefore, in a single poly non-volatile memory device array, one cellformed with a selection transistor 810, a sensing transistor 820, and acontrol gate 170 is formed in an array form to share a control gate anda source electrode of an adjacent selection transistor, and program anderase operation voltages may be applied to the control gate and thesource electrode of the selection transistor.

In an example, in single poly non-volatile memory device arrays, atleast one single poly non-volatile memory device to be a target ofprogram or erase may be selected, a programming voltage may be appliedto the selected at least one single poly non-volatile memory device, andin order to minimize a voltage difference applied to unselected singlepoly non-volatile memory devices of a plurality of single polynon-volatile memory devices upon performing a program or eraseoperation, a portion of a programming voltage may be applied tounselected single poly non-volatile memory devices. For example, aportion of the programming voltage applied to the unselected single polynon-volatile memory devices may be ⅓ of the programming voltage.

FIG. 7 is a conceptual diagram illustrating a method of arranging thesingle poly non-volatile memory device of FIG. 1 according to anexample. In FIG. 7, for a concept description, four memory devices arearranged, but the number of memory devices is not limited thereto.

Referring to FIG. 7, in a method of arranging the single polynon-volatile memory devices 100 according to an example, each of thefirst to fourth single poly non-volatile memory devices 100 a, 100 b,100 c, and 100 d may be connected to a programming voltage (+V_(PP),−V_(PP)) or a portion (+V_(PP)/n, −V_(PP)/n) (n is the positive number)of the programming voltage. In a method of arranging the single polynon-volatile memory devices 100, at least one single poly non-volatilememory device to be a target of program or erase may be selected and aprogramming voltage (+V_(PP), −V_(PP)) may be applied to a sourceelectrode and a control gate of the selected at least one single polynon-volatile memory device. In a method of arranging the single polynon-volatile memory devices 100, a programming voltage (+V_(PP),−V_(PP)) or a portion (+V_(PP)/n, −V_(pp)/n) (n is the positive number)of the programming voltage may be connected to each of unselected (or notarget of program-erase) single poly non-volatile memory devices.

In an example, in a method of arranging the single poly non-volatilememory devices 100, the first single poly non-volatile memory device 100a may be selected as a target of program or erase and the second tofourth single poly non-volatile memory devices 100 b, 100 c, and 100 dmay not be selected. In this case, a programming voltage (+V_(PP),−V_(PP)) may be applied to the source electrode and the control gate ofthe first single poly non-volatile memory device 100 a, and a voltagedifference between both ends thereof may be 2V_(PP). A programmingvoltage (+V_(PP), −V_(PP)) or a ⅓ programming voltage (+V_(PP)/3,−V_(PP)/3) may be connected to each of the second to fourth single polynon-volatile memory devices 100 b, 100 c, and 100 d, and voltagedifferences applied to each of the second to fourth single polynon-volatile memory devices 100 b, 100 c, and 100 d may be 2/3V_(PP),2/3V_(PP), and 2/3V_(PP), respectively. Therefore, when a programmingvoltage (+V_(PP), −V_(PP)) or a ⅓ programming voltage (+V_(PP)/3,−V_(PP)/3) is applied to a source electrode and a control gate of eachof the unselected single poly non-volatile memory devices 100 b, 100 c,and 100 d, the entire voltage difference applied to each of theunselected single poly non-volatile memory devices 100 b, 100 c, and 100d may be the same.

In more detail, a voltage may be applied to a source electrode and acontrol gate of the single poly non-volatile memory device 100 a thatselects a programming voltage (+V_(PP), −V_(PP)). That is, when aprogramming voltage +V_(PP) is applied to the control gate and when aprogramming voltage −V_(PP) is applied to the source electrode, theselected single poly non-volatile memory device 100 a may perform aprogram operation. In this case, the adjacent unselected single polynon-volatile memory device 100 b is commonly connected to a sourceelectrode of the selected single poly non-volatile memory device 100 aand thus a programming voltage −V_(PP) is applied thereto. However, whena ⅓ programming voltage −V_(PP)/3 is applied to the control gateelectrode of the unselected single poly non-volatile memory device 100b, a voltage difference applied to the unselected single polynon-volatile memory device 100 b becomes 2/3V_(PP). Similarly, a controlgate is commonly connected to the adjacent unselected single polynon-volatile memory device 100 c and thus a programming voltage V_(PP)is applied thereto, but when a ⅓ programming voltage V_(PP)/3 is appliedto the source electrode, a voltage difference applied to the unselectedsingle poly non-volatile memory device 100 c becomes 2/3V_(PP).Therefore, a ⅓ programming voltage −V_(PP)/3 is applied to a controlgate of the automatically unselected single poly non-volatile memorydevice 100 d and a ⅓ programming voltage V_(PP)/3 is applied to a sourceelectrode thereof and thus a voltage difference applied to theunselected single poly non-volatile memory device 100 d becomes2/3V_(PP).

In another example, a programming voltage (+V_(PP), −V_(PP)) or avoltage (+V_(PP)/x, −V_(PP)/x) (x is a value approximate to 3)approximate to a ⅓ programming voltage is connected to control gates andsource electrodes of each of the unselected single poly non-volatilememory devices 100 b, 100 c, and 100 d, and the entire voltagedifferences applied to each of the second to fourth single polynon-volatile memory devices 100 b, 100 c, and 100 d may be a valueapproximate to 2/3V_(PP). In more detail, a voltage may be applied tothe source electrode and the control gate of the single polynon-volatile memory device 100 a that selects a programming voltage(+V_(PP), −V_(PP)). That is, when a programming voltage −V_(PP) isapplied to the control gate and when a programming voltage V_(PP) isapplied to the source electrode, the selected single poly non-volatilememory device 100 a may perform an erase operation. In this case, theadjacent unselected single poly non-volatile memory device 100 b iscommonly connected to a source electrode of the selected single polynon-volatile memory device 100 a and thus a programming voltage V_(PP)is applied thereto. However, when a voltage +V_(PP)/x (x is a valueapproximate to 3) approximate to a ⅓ programming voltage is applied tothe control gate of the unselected single poly non-volatile memorydevice 100 b, a voltage difference applied to the unselected single polynon-volatile memory device 100 b becomes a value approximate to2/3V_(PP).

A voltage difference applied to the unselected single poly non-volatilememory devices 100 c and 100 d with this method becomes a valueapproximate to 2/3V_(PP).

Therefore, in a method of arranging a single poly non-volatile memorydevice according to the present invention, a voltage difference appliedto both ends of each of unselected single poly non-volatile memorydevices can be removed or a voltage difference can be reduced to a muchsmaller value. Further, in a method of arranging a single polynon-volatile memory device, reliability of programmed data can beimproved, the cycling number of a memory device can increase, anddisturbance between unselected single poly non-volatile memory devicescan be prevented.

FIG. 8 is a circuit diagram illustrating the single poly non-volatilememory device of FIG. 1, and FIG. 9 is a circuit diagram illustratingsingle poly non-volatile memory devices arranged with a method ofarranging a single poly non-volatile memory device of FIG. 7.

Referring to FIGS. 8 and 9, a plurality of single poly non-volatilememory devices 100 may be connected in parallel. For example, one columnof single poly non-volatile memory devices 100 may receive the samedrain voltage VBL and source voltage VSL. That is, the drain electrode193 and the source electrode 191 of one column of single polynon-volatile memory devices 100 may be connected. A selection transistor810 may be turned on or turned off through a voltage applied to theselection gate electrode 192. The sensing transistor 820 may be tunneledaccording to a voltage difference between the control gate electrode 194and the source electrode 191. Further, one row of single polynon-volatile memory devices 100 may receive the same control gatevoltage VCG and selection gate voltage VSG. That is, the control gateelectrode 194 and the selection gate electrode 192 of one row of singlepoly non-volatile memory devices 100 may be connected.

In an example, a plurality of single poly non-volatile memory devices100 may receive a programming voltage (+V_(PP), −V_(PP)) or a ⅓programming voltage (+V_(PP)/3, −V_(PP)/3) through the drain electrode193, the source electrode 191, the control gate electrode 194, and theselection gate electrode 192.

FIG. 10 is a graph illustrating a performance of single polynon-volatile memory devices arranged with a method of arranging a singlepoly non-volatile memory device of FIG. 7.

Referring to FIG. 10, a method of arranging a single poly non-volatilememory device increases the cycling number, compared with technologythat connects unselected single poly non-volatile memory devices to theground GND. More specifically, when the cycling number increases, aproblem occurs that a program threshold voltage PGM V_(TH) or an erasethreshold voltage ERS V_(TH) of an unselected single poly non-volatilememory device changes and thus data stored at the single polynon-volatile memory device may be changed. However, as described withreference to FIGS. 7A and 7B, in a method of applying a voltageapproximate to ⅓ programming voltage instead of the ground GND to asource electrode and a control gate of the unselected single polynon-volatile memory devices, even if the cycling number arrives at 1000or more, a program threshold voltage PGM V_(TH) and an erase thresholdvoltage ERS V_(TH) do not almost change and thus stored data can bestably maintained.

Therefore, the single poly non-volatile memory device 100 may disposethe selection transistor and the sensing transistor at the first well121 and dispose the control gate 170 at the second well 122 separatedfrom the first well 121. The single poly non-volatile memory device 100may sequentially dispose the source electrode 191, the selectiontransistor, the sensing transistor, and the drain electrode 193 at thefirst well 121 and may form an entire area of the control gate 170 andthe control gate electrode 194 within the second active area 220.Further, the single poly non-volatile memory device 100 may form thesecond doping layer 132 that shares a drain area of the selectiontransistor and a source area of the sensing transistor. Resultantly, thesingle poly non-volatile memory device 100 can improve program and eraseoperation efficiency and reduce an area of a memory device.

FIG. 11 is a diagram illustrating an example of a method ofmanufacturing a single poly non-volatile memory device illustrated inFIGS. 1A and 1B.

Referring to FIG. 11, in step 1000 a first type lower well 110 is formedon the second type substrate 10. By doping and diffusing first typeimpurities in the second type substrate 10, the first type lower well110 may be formed from an upper portion of the lower well 110 to asurface of an active area.

In step 1100 the first and second wells (121 and 122) are formed in thefirst type lower well 110. By doping first type or second typeimpurities in the first type lower well 110, the first and second wells121 and 122 may be formed.

The first and second wells 121 and 122 may be separately formed in anupper portion of the first type lower well 110. The first and secondwells 121 and 122 each may correspond to a first or second active area.The first or second active area may be separated by the insulating layer120.

In step 1200, the selection transistor 810 and sensing transistors 820are formed in the first well 121. As illustrated in FIG. 11, steps 1200and 1300 may occur simultaneously.

In step 1300, a control gate 170 may be formed in an upper portion ofthe second well 122 separated on an opposite side of the sourceelectrode 191 from the first well 121. Further in step 1400, a seconddoping layer 132 that shares a drain area of the selection transistor810 and a source area of the sensing transistor 820 may be formed. Thesingle poly non-volatile memory device 100 may omit a terminal betweenthe drain area of the selection transistor and the source area of thesensing transistor through the second doping layer 132. In this manner,the single poly non-volatile memory device 100 may reduce an areathereof through the second doping layer 132.

Although examples of the present disclosure have been described indetail hereinabove, it should be clearly understood that many variationsand modifications of the basic inventive concepts herein described,which may appear to those skilled in the art, will still fall within thespirit and scope of the examples of the present disclosure as defined inthe appended claims.

What is claimed is:
 1. A method of manufacturing a single poly non-volatile memory device, the method comprising: forming a first type lower well by doping first type impurities in a semiconductor substrate; forming first and second wells separated in an upper portion of the first type lower well and forming a first type well to enclose each of the first and second wells by doping second type impurities; and forming a selection transistor and a sensing transistor in an upper portion of the first well and simultaneously forming a control gate in an upper portion of the second well separated on an opposite side of the source electrode from the first well.
 2. The method of claim 1, wherein the selection transistor and the sensing transistor are formed in a first active area and comprise a gate of the sensing transistor and a gate of the selection transistor.
 3. The method of claim 2, wherein the control gate and the gate of the sensing transistor are connected.
 4. The method of claim 2, further comprising forming a doping layer that shares a drain area of the selection transistor and a source area of the sensing transistor. 